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  • FD101 Universal Force Sensor Dies

    FD101 piezoresistive sensor die is designed for force measurements universally. For example, if one of such the sensor dies is bonded on a bending beam, it forms a half bridge measuring circuit, or if two of such the sensor dies are bonded on the top- and bottom-surface of the bending beam respectively, they form a […]
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  • SE105 Flip-Chip Pressure Sensor Dies for Harsh Environment

    SE105 piezoresistive pressure sensor die from BCM SENSOR is designed of a flip-chip structure for harsh environment application.   Thanks to the flip-chip structure, the SE105 sensor die features various superiorities as follows: Both the die-bonding and the wire-bonding processes are simplified to one process. As a result, the SE105 becomes a surface mounting device. […]
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  • Thermal Gas Flow Sensors Come Back to Life

    Regarding the thermal gas flow sensor model TFS2100, BCM SENSOR has renewed its manufacturing processes in mass production.Regarding the thermal gas flow sensor model TFS2100, BCM SENSOR has renewed its manufacturing processes in mass production. Now the datasheet of this model TFS2100 can be found again on BCM SENSOR website as linked below: https://www.bcmsensor.com/products/thermal-gas-flow-transmitters/tfs2100-thermal-mass-flow-transmitters/ At […]
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