BCM SENSOR is proud of launching a new version of model 500G pressure sensors which is made from 316L stainless steel (SS). This model is designed for high pressure application up to 5000bar. Thanks to the unique mono-block structure, the 500G sensors can have excellent resistance to overload pressure – proof pressure up to 300%fs […]

FD101 piezoresistive sensor die is designed for force measurements universally. For example, if one of such the sensor dies is bonded on a bending beam, it forms a half bridge measuring circuit, or if two of such the sensor dies are bonded on the top- and bottom-surface of the bending beam respectively, they form a […]

SE105 piezoresistive pressure sensor die from BCM SENSOR is designed of a flip-chip structure for harsh environment application.   Thanks to the flip-chip structure, the SE105 sensor die features various superiorities as follows: Both the die-bonding and the wire-bonding processes are simplified to one process. As a result, the SE105 becomes a surface mounting device. […]